Formation of this film capacitors
US6270835A · kind A · utility
70Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1999 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Oct 7, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.