Making and using an ultra-thin copper foil
US6270889A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1998 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Dec 23, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer by electrodeposition. The organic release layer preferably is a nitrogen-containing compound, a sulfur-containing compound, or a carboxylic acid, which provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.