Housing for electronic component, and method of producing the same

US6271471A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Manfred Leiter · Stuttgart, DE
• Kurt Weiblen · Metzingen, DE
• Bernhard Lucas · Alagón, ES
• Frank Schatz · Kornwestheim, DE
• Thomas Beez · Weinsberg, DE
• Juergen Seiz · Welzheim, DE
• Helmut Baumann · Gomaringen, DE
• Herbert Olbrich · Rutesheim, DE
• Heinz Eisenschmid · Stuttgart, DE
• Eberhard Moess · Murrhardt, DE
• Joachim Dutzi · Rutesheim, DE
• Andreas Kugler · Alfdorf, DE

Key dates

• Filing date: Dec 2, 1999
• Grant date: Aug 7, 2001
• Expiry date: Dec 2, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12033
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A housing for an electronic component has a bottom part, a wall part, a cover part which together are adapted to cover the electronic component, a contact spring provided on the cover part for producing an electrical connection with a terminal of the component, the cover part and the contact spring being formed as a one-piece integral element.