Wire bonding method and apparatus and semiconductor device
US6271601A · kind A · utility
10Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1999 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | May 6, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2076
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding method and apparatus implement the flatly thinner plastic deformation for the joint section of a wire, which has a diameter ranging 100-600 .mu.m, on its feed side, feed out and position the flatly deformed wire joint section to a target joint surface, and join the wire to it by pressing the positioned wire joint section, with vibration being applied, onto the joint surface with a ultrasonic wire bonder. A high-power semiconductor device fabricated based on this scheme has a long life of wire joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.