Laser diode package with slotted lead
US6272159A · kind A · utility
7Cited by
1References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 1998 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Dec 22, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/023
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser diode or laser diode bar mounted on a heat sink and having an insulating layer of greater thickness also mounted on the heat sink requires a lead overlying both the insulating layer and the diode to bend downward for making electrical contact. Failures have been found to occur at the bend. The provision of a pattern of slots at the bend alleviates the problem by reducing stress there. The use of such slotted leads is disclosed for diodes or diode bars individually or in a stack arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.