Methods for the production of printed circuit boards with through-platings

US6272745A · kind A · utility

Assignee

• Photo Print Electronics GmbH · DE

Inventors

• Peter Kersten · Leonberg, DE
• Jörg Kiefer · Schopfheim, DE

Key dates

• Filing date: Mar 13, 1998
• Grant date: Aug 14, 2001
• Expiry date: Mar 13, 2018

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49165
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Methods for the production of printed circuit boards (1) with at least one electrically conductive through-plating which runs in a hole (5) in an insulating base material (2) from a first to a second surface include the following steps. The base material is pressed on its surfaces with two-layered foils (3, 4) consisting of a Cu foil (31, 32) covered with a Cu layer (32', 42'), an acrylonitrile-butadiene-styrene-copolymer film (32", 42") or a self-adhesive plastic film (32*, 42*) in such a way that the Cu foils adhere well to the base material. The holes are produced and they as well as the exposed surfaces of the layers (32', 42'; 32", 42"; 32*, 42*) are provided with a further Cu layer (6, 6'). The metallized holes are completely filled with an insulating material (7) or with a conductive material (7'; 8) by spreading on with a squeegee or by rolling on to the exposed surface of the Cu layer (6, 6'). The layers (32', 42'; 32", 42"; 32*, 42*) are removed together with the Cu layer (6, 6'). Stubs (71, 72; 81, 82) which project beyond the remaining Cu foils (31, 41) are removed after the curing of the material (7, 7'; 8) thereby planarizing the Cu foils (31, 41) being now ready for …