Multi-layer, multi-grade multiple cutting surface PDC cutter
US6272753A · kind A · utility
33Cited by
25References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 27, 1999 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Sep 27, 2019 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5673
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
An improved polycrystalline diamond composite ("PDC") cutter with secondary PDC cutting surfaces in addition to a primary PDC cutting surface is formed comprising of at least two wafers of cemented carbide bonded together. The secondary cutting surfaces are formed by compacting and sintering diamond in grooves formed at the surface of the wafers. Wafers of different grades of cemented carbide may be used. Moreover, different grades of diamond may be compacted and sintered in different grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.