Apparatus and method for embossing and printing elongated substrates
US6272982A · kind A · utility
18Cited by
17References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2000 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Feb 11, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41F19/02
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for printing and embossing elongated substrates provide for both length and position registration with respect to the printed and embossed patterns. The ink pattern to embossed pattern error is corrected by stretching or relaxing the substrate between the printing and embossing assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.