Micromachined pump apparatus
US6273687A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1999 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Nov 23, 2019 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04B43/043
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A micromachined pump apparatus 1 includes a substrate 2 having upper and lower surfaces and a plurality of lengthwise arranged apertures 2A-2E, each of which has an upper surface opening and a lower surface opening. A plurality of diaphragms 6A-6E close the upper surface openings of the apertures 2A-2E, respectively. A guide plate 3 is fixedly mounted on the upper surface of the substrate 2 and defines a passage 3a through which an object fluid is moved by cooperating with the diaphragms on the upper surface of the substrate 2. A base plate 4 is fixedly mounted at its upper surface on the lower surface of the substrate 2, thereby enclosing an operating fluid in each of the apertures 2A-2E. An electrically operated heater device 5 is provided on the upper surface of the base plate 4 for heating the fluids in the apertures 2A-2E, respectively, in such a manner that whenever the fluids are heated the resultant expansion of the respective operating fluid expands the diaphragms, respectively, toward the passage. The expansions of the diaphragms 6A-6E are made in sequence, thereby forcing the object fluid to move through the passage 3a.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.