Wafer connector with improved grounding shield
US6273758A · kind A · utility
81Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2000 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | May 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6597
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical connector module is provided having a housing with a receptacle. Conductive contacts are located within the receptacle and a grounding shield is provided that partially defines the top of the connector housing. A depression is formed in the grounding shield and extends into abutting contact with one of the terminals held in the connector housing to effectuate an electrical connection therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.