Electroplating apparatus
US6274010A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1998 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Jul 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for electroplating at least one substrate is disclosed as including a trough, two anodes, at least one bath and two poly-tetrafluoroethylene sheets or a number of substantially rigid polypropylene plates, in which the trough supports the substrate and is in an electrically conductive relationship therewith, and the bath contains the anodes, the trough and an electrolyte, in which, in operation, an electric field exists in the electrolyte between the trough and the anodes, and in which the poly-tetrafluoroethylene sheets or the polypropylene plates are movable to vary the amount of electric current passing between the trough and the anodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.