Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
US6274015A · kind A · utility
20Cited by
26References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1998 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Aug 12, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Described is a method for producing a diffusion bonded sputtering assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.