Low adhesion semi-conductive electrical shields
US6274066A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 11, 2000 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Oct 11, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B9/027
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A low adhesion semiconductive dielectric shield for use with cross-linked polyethylene, ethylene-propylene rubber or ethylene-propylene-diene rubber (EPDM rubber) insulation. The dielectric shield comprises a base polymer which is a copolymer of ethylene with a mono-unsaturated ester; a conductive filler in an amount sufficient to give an electrical resistivity below 550 ohms-meter and as an adhesion adjusting device an ethylene vinyl acetate, ethylene alkyl acrylate or ethylene alkyl methacrylate copolymer having a molecular weight above 20,000 daltons and a polydispersity greater than 2.5 wherein the adhesion between the insulation and the semiconductive shield is between about 3-26 lbs per 1/2 inch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.