Circuit member and circuit board
US6274225A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1999 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Nov 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a rigid circuit member obtained by bending a composite laminate comprising a circuit conductor made of a metal foil interposed between plastic films having an elastic modulus of not less than 450 kg/mm.sup.2 with an adhesive, characterized in that as said plastic film there is used a polyethylene naphthalate film. The present invention also provides a circuit board adapted to be connected to a conductor on a rigid substrate, characterized in that said circuit conductor is interposed between polyethylene naphthalate films. The present invention further provides a printed circuit board, comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm.sup.2, not more than 1.5.times.10.sup.-5 /.degree. C., a hygroscopic expansion coefficient of not more than 1.2.times.10.sup.-5 /%RH, a water vapor permeability of not more than 15 g/m.sup.2 /mil day, a percent water absorption of not more than 2% and a melting point of not higher than 280.degree. C. and a conductor circuit integrated into a laminate with an adhesive layer provided interposed therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.