Patent · US Expired

Substrates seeded with precious metal salts, process for producing the same and their use

US6274241A · kind A · utility

0Cited by
7References
30Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 14, 1999
Grant dateAug 14, 2001
Priority date
Expiry dateJun 14, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/2998
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

To provide a substrate enclosed in a uniform nucleation layer, a substrate is nucleated with a noble metal salt where the noble metal salt is chemically bound to the substrate, and a method is described for binding a noble metal salt chemically to a substrate. To provide a metal plated powder, a powder is nucleated with a noble metal salt and the nucleation is coated with a metal layer. A method is also provided for nucleating the powder surface with a noble metal salt in such a manner that it is chemically bound to the substrate and then metal plated by a conventional electroless method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.