Substrates seeded with precious metal salts, process for producing the same and their use
US6274241A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1999 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Jun 14, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
To provide a substrate enclosed in a uniform nucleation layer, a substrate is nucleated with a noble metal salt where the noble metal salt is chemically bound to the substrate, and a method is described for binding a noble metal salt chemically to a substrate. To provide a metal plated powder, a powder is nucleated with a noble metal salt and the nucleation is coated with a metal layer. A method is also provided for nucleating the powder surface with a noble metal salt in such a manner that it is chemically bound to the substrate and then metal plated by a conventional electroless method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.