Epoxy/thermoplastic photocurable adhesive composition
US6274643A · kind A · utility
9Cited by
52References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2000 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Jul 26, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.