Epoxy resin system
US6274682A · kind A · utility
3Cited by
8References
6Claims
0Family size
Inventors
Key dates
| Filing date | Jan 25, 2000 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Jan 25, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition containing a) an epoxy resin and b) a liquid amine terminated polyamide curing agent prepared by condensing an aminoalkylpiperazine and a dicarboxylic acid. The epoxy resin composition typically requires less than 35% of solvent to produce a sprayable viscosity. The cured epoxy composition has good flexibility. A hydroxy-functional flexibilized resin is also produced by reacting (a) an epoxy resin, (b) a liquid aminoalkylpiperazine-based amine terminated polyamide and (c) a hydroxy-functional amine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.