Devices formable by low temperature direct bonding
US6274892A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1998 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Mar 9, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8325
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment of a semiconductor device includes a laterally extending semiconductor base, a buffer adjacent the base and having a first conductivity type dopant, and a laterally extending emitter adjacent the buffer and opposite the base and having a second conductivity type dopant. The buffer is relatively thin and has a first conductivity type dopant concentration greater than a second conductivity type dopant concentration in adjacent emitter portions to provide a negative temperature coefficient for current gain and a positive temperature coefficient for forward voltage for the device. The buffer may be silicon or germanium. A low temperature bonded interface may be between the emitter and the buffer or the buffer and the base. Another embodiment of a device may include a laterally extending localized lifetime killing portion between oppositely doped first and second laterally extending portions. The localized lifetime killing portion may comprise a plurality of laterally confined and laterally spaced apart lifetime killing regions. Another device may include one or more PN junctions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.