Patent · US Expired

Integrated inductor device and method for fabricating the same

US6274920A · kind A · utility

45Cited by
4References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 24, 1999
Grant dateAug 14, 2001
Priority date
Expiry dateNov 24, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D84/00

Abstract

A method for fabricating an inductor device includes the steps of forming a plurality of trenches in a substrate by selectively etching the substrate, implanting dopants into sidewalls and bottom portion of each trench, forming an oxide layer by oxidizing the trenches and the substrate and simultaneously forming a doped layer in the surroundings of the trenches by diffusing the dopants into the substrate, and forming a dielectric layer on a resultant structure to fill the entrance of the trenches, thereby forming air-gap layers inside the trenches, thereby reducing a parasitic capacitance and a magnetic coupling.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.