Surface mountable LED package
US6274924A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1998 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Nov 5, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
Abstract
An LED package includes a heat-sinking slug that is inserted into an insert-molded leadframe. The slug may include an optional reflector cup. Within this cup, the LED and a thermally conducting sub-mount may be attached. Wire bonds extend from the LEDs to metal leads. The metal leads are electrically and thermally isolated from the slug. An optical lens may be added by mounting a pre-molded thermoplastic lens and a soft encapsulant or by casting epoxy to cover the LED or by a cast epoxy lens over a soft encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.