Patent · US Expired

Surface mountable LED package

US6274924A · kind A · utility

364Cited by
2References
28Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 5, 1998
Grant dateAug 14, 2001
Priority date
Expiry dateNov 5, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/12041

Abstract

An LED package includes a heat-sinking slug that is inserted into an insert-molded leadframe. The slug may include an optional reflector cup. Within this cup, the LED and a thermally conducting sub-mount may be attached. Wire bonds extend from the LEDs to metal leads. The metal leads are electrically and thermally isolated from the slug. An optical lens may be added by mounting a pre-molded thermoplastic lens and a soft encapsulant or by casting epoxy to cover the LED or by a cast epoxy lens over a soft encapsulant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.