Hermetically sealed semiconductor laser device
US6275513A · kind A · utility
26Cited by
103References
55Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1999 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Jun 4, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/18366
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A wafer assembly that includes a wafer substrate. A plurality of micro-optomechanical or micro-optoelectrical devices are positioned on a surface of the wafer substrate. Each micro-optomechanical or micro-optoelectrical device has a seal surface. A plurality of seal caps are coupled to the micro-optomechanical or micro-optoelectrical devices. Each seal cap has a seal ring. The seal cap seal ring is coupled to a seal surface of the micro-optomechanical or micro-optoelectrical device to form a hermetic seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.