Method and apparatus for forming plugs in vias of a circuit board layer
US6276055A · kind A · utility
18Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1998 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Sep 24, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming one or more plugs in a circuit board layer is described which includes providing the circuit board layer, the circuit board layer having a first surface, a second surface, and defining a via containing a plug material in a volatile solvent, evaporating the volatile solvent, and curing the plug material. A product made according to the above method is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.