Jet soldering system and method
US6276589A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1996 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Sep 23, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/013
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.