Process for the production of a holding device for semiconductor disks and holding device produced by this process
US6276592A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1999 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Nov 30, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2035/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for the production of a device is disclosed which is suitable for holding semiconductor disks (wafers) during diverse, preferably thermal, machining processes and for transporting semiconductor disks between different machining stations and which is formed of a plurality of individually pre-manufactured device parts that are assembled and connected with one another. The invention is further directed to a holding device for semiconductor disks which is manufactured by the production process according to the invention. In a process of the type described above, the device parts are first pre-manufactured separately and independent from one another from single-crystal or polycrystalline silicon and, in so doing, are provided with fitting surfaces which correspond to one another. The adjacent device parts with opposite fitting surfaces are then joined one inside or against the other and the fitting surfaces are connected with one another by diffusion welding and/or by soldering, wherein germanium powder is used as solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.