Patent · US Expired

Method of making fullerene-decorated nanoparticles and their use as a low dielectric constant material for semiconductor devices

US6277766A · kind A · utility

59Cited by
11References
17Claims
0Family size

Inventor

Key dates

Filing dateFeb 3, 2000
Grant dateAug 21, 2001
Priority date
Expiry dateFeb 3, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S977/773
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

This invention provides a process for making an insulation layer for use in microelectronic devices, whereby capacitive coupling and propagation delay in the microelectronic devices are reduced. This invention can include the formation of a stable solution of nanometer-scale particles consisting of an inorganic core 10 that is decorated with a known number of fullerene molecules 20, and including a soluble component that can act to bind the particles together into an integral structure. This solution can be applied to a microelectronic substrate, and dried to form a continuous, porous layer. Porous layers formed by the process of this invention possess a very low dielectric constant, and can be produced using equipment and techniques common and available to those skilled in the art of microelectronic fabrication.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.