Ball-grid-array-type semiconductor device and its fabrication method and electronic device
US6278180A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1998 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Apr 28, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball-grid-array-type semiconductor device comprising a package substrate constituted with a ceramic wiring board having a semiconductor chip mounting portion on the principal plane and electrodes arranged like an array on the back, a semiconductor chip secured to the principal plane of the package substrate, connection means for electrically connecting the electrodes of the semiconductor chip with the wiring of the wiring board, a sealing body provided for the principal plane side of the wiring board and made of an insulating resin to cover the semiconductor chip and the connection means, a pedestal layer made of low-fusion-point solder and formed on the electrodes, and a metallic ball secured onto the pedestal layer; wherein a buffering layer made of high-fusion-point solder which covers the entire surface of the electrodes and whose margin extends up to a predetermined length on the back of the package substrate is formed on the electrodes and the pedestal layer is formed on the buffering layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.