Smart bi-metallic heat spreader
US6278607A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 1998 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Aug 6, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A variable area heat sink has a first heat sink area and a second heat sink area. A bridge is connected to the first heat sink area and includes a bi-metallic portion operable to connect and disconnect with the second heat sink area in response to a temperature change in the bridge which is sufficient to distort the bi-metallic portion from a first shape to a second shape. The first heat sink area may be installed in a computer chassis adjacent a first heat producing component. The second heat sink area may be installed in the chassis adjacent a second heat producing component. The combination of heat sink areas may be enlarged or reduced in size due to the coupling or uncoupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.