Socket apparatus for IC packages
US6280219A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2001 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Jan 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A socket (10) having a base (12), an adapter (24) which has a mounting seat for a semiconductor device (100) and which is installed on the base, and a plurality of contact members (14) which are caused to engage respective terminals of the semiconductor device that has been placed on the mounting seat of the adapter. Each contact member (14) has a pair of arms (90, 130, 144) provided by the bifurcation of one end, with the other end being fixed to the base. Each contact member is caused to nip a respective terminal (102) of the semiconductor device arranged on the mounting seat at the tip portion of the pair of arms and has butting surfaces (92, 131, 148) that determine the minimum spacing distance of the tip portions of the arms on the opposing sides of each pair of arms. Contact members (14) are connected to socket terminals (21) via a connector including an expansion board (20), conductive wires (150, 160), flexible printed substrate (170), sockets (190, 200, 214) and lead guides (222, 224) in several embodiments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.