Edge polishing composition
US6280652A · kind A · utility
17Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1999 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Jun 2, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An edge polishing composition for wafers, comprising water and silicon dioxide having an average particle size of from 70 to 2,500 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.