Process for forming polymer thick film resistors and metal thin film resistors on a printed circuit substrate
US6280907A · kind A · utility
6Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1999 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Jun 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1453
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is disclosed for forming resistors on a printed circuit substrate. The method includes the step of applying a photoresist layer onto substrate, and forming openings in the photoresist layer to expose the preselected regions for resistors, such that polymer thick resist pastes as well as resistive metallic films can be applied onto the substrate through these openings with precise geometry. The process according to the invention has higher accuracy and greater processing flexibility than the prior art processes where the resistor pastes are directly applied onto the substrate by screen printing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.