Method of making an electronic component, and an electronic component
US6281048A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1999 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Apr 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07802
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of making an electronic component, in particular a contactless card which includes an antenna. The card has an insulating substrate provided with conductive tracks, and a semiconductor chip mounted on the substrate. Conductive tracks are formed on the substrate by screen printing using a conductive ink. A semiconductor chip as provided with contact areas is supplied, and conductive terminals, or "bumps", are formed on at least some of the contact areas. The chip is disposed on the substrate, before the conductive ink is dry, so that the ends of the bumps penetrate into the ink at the corresponding locations. The chip is fixed mechanically to the substrate by polymerizing an insulating adhesive resin disposed between the bottom face of the chip and the top face of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.