Polymeric coating compositions, polymer coated substrates, and methods of making and using the same
US6281275A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 1998 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention is in a conductive prepolymer composition which when polymerized and cured is used to coat a substrate material such as steel, stainless steel, iron, brass, copper, aluminum, platinum, titanium, silver, gold, Telfon, plastics, glass, or combinations thereof. It comprises: (a) from 25 to 99 parts by weight of a poly(amide-imide) prepolymer; (b) from 1 to 25 parts by weight of a trifunctional ester selected from the group consisting of trifunctional methacrylate ester, trifunctional acrylate ester, and mixtures thereof; (c) from 0.5 to 15 parts by weight of an organo-reactive silane consisting of an amino group containing alkoxysilane having the formula NH.sub.2 (CH.sub.2).sub.n Si(OC.sub.2 H.sub.5).sub.3, where n is an integer from 1 to 20; and (d) a conductive additive. The invention also provides polymer coated substrates having a tenaciously bound polymer layer which is corrosion resistant, has advantageous properties of conductivity and can be soldered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.