Semiconductor device test board and a method of testing a semiconductor device
US6281693A · kind A · utility
3Cited by
7References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 2, 1998 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Jun 2, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device test board for performing a test on a semiconductor device includes a supporting board formed of an insulating material and contact parts which are formed on the supporting board, and which can be connected to solder bumps formed on a semiconductor device to be tested. Each of the contact parts includes contact base layers formed of conductive materials other than solder and a solder layer having a thin-film shape, and covering the contact base layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.