Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
US6282095A · kind A · utility
236Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2000 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Apr 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB reference planes. The RF impedance shorting path uses existing package pins with dedicated electrical paths through the package to the bottom surface of the heat sink. Such an arrangement provides very low RF impedance because of the minimal length and resistance of the shorting path, and also provides minimal disruption of the PCB design rules and tolerances by using existing package leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.