Photoelectronic device and method of manufacturing the same
US6282350A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1999 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Aug 24, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.