Forming plugs in vias of circuit board layers and subassemblies
US6282782A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 1999 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Sep 2, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a subassembly for use in a printed circuit board is described. This method includes providing a subassembly including a circuit board layer laminated to two sheets of conductive material with two intermediate sheets of prepreg material, forming a via in the assembly, plating the via, filling the via with a plug material in a volatile solvent, evaporating the volatile solvent, and curing the plug material. Also described is a method of forming a partially filled via in a circuit board layer and a method of forming a thermally conductive plug in a circuit board layer for the transfer of thermal energy from one surface of the circuit board to the other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.