In situ friction detector method for finishing semiconductor wafers
US6283829A · kind A · utility
40Cited by
9References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 5, 1999 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Nov 5, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65H2701/3772
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of using of using a friction detector for finishing semiconductor wafers. The method uses secondary friction sensors which can interpolate and add improved control to finishing. The method aids control of finishing while using lubricating boundary layers in the operative finishing interface. The method aids control of differential lubricating boundary layers and improved differential finishing of semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing. Defects can be reduced using the in situ friction detector method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.