Process for applying polymer particles on substrate and coatings resulting therefrom
US6284311A · kind A · utility
39Cited by
13References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1998 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Oct 5, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D1/24
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heated substrate is dipped into a fluidized bed containing particles of polymer to coat the substrate. The coating can subsequently be leveled (and cured if thermosetting) by heating the coated substrate above the melting point of the polymer. The process can be employed to provide desirable properties such as corrosion resistance and aesthetic qualities to the substrate, and to apply very thin coatings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.