Thermal transfer donor element having a heat management underlayer
US6284425A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 1999 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Dec 28, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/46
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal transfer donor element is disclosed that includes a substrate, a transfer layer, a light-to-heat conversion layer disposed between the substrate and the transfer layer, and an underlayer disposed between the substrate and the light-to-heat conversion layer. The underlayer manages heat flow between layers of the donor element during imaging. For example, the underlayer can increase heat transport from the light-to-heat conversion layer to the substrate to prevent overheating. The underlayer can also be used to insulate the substrate from heat generated in the light-to-heat conversion layer or to increase heat flow to the transfer layer during imaging. Managing heat flow using an underlayer can improve transfer properties and/or reduce defect formation during imaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.