Molding compositions comprising random copolyamides, their use, and process for their preparation

US6284830A · kind A · utility

Assignee

• BASF SE

Inventors

• Axel Gottschalk · Neustadt, DE
• Stefan Grutke · Neustadt, DE
• Gunter Pipper · Bad Dürkheim, DE
• Peter Wolf · Gaithersburg, US
• Martin Weber · Maikammer, DE

Key dates

• Filing date: Jul 15, 1998
• Grant date: Sep 4, 2001
• Expiry date: Jul 15, 2018

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L71/10
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The molding composition comprises components A, B and, if desired, components C to E, the total weight of which is 100% by weight: PA1 a: as component A, from 5 to 95% by weight of a random copolyamide made from PA2 a1: from 95.1 to 99.9% by weight of component A1 made from equimolar amounts of at least one linear aliphatic diamine and at least one linear aliphatic dicarboxylic acid PA2 a2: from 0.1 to 4.9% by weight of component A2 made from equimolar amounts of at least one linear aliphatic diamine and isophthalic acid PA1 b: from 5 to 95% by weight of a copolymer component B, different from component A, selected from: PA2 b1: component B1 made from at least one, if desired modified, polyarylene ether, or PA2 b2: component B2 made from, as component B21, from 60 to 99% by weight of at least one polyolefin homo- or copolymer and, as component B22, from 1 to 40% by weight of at least one modified polyolefm homo- or copolymer, or PA2 b3: component B3 made from, as component B31, from 70 to 100% by weight of at least one SAN, ABS or ASA polymer and, as component B32, from 0 to 30% by weight of at least one modified SAN, ABS or ASA polymer PA1 c: as component C, from 0 to 20% by weigh…