Method and component for forming an embedded resistor in a multi-layer printed circuit
US6284982A · kind A · utility
16Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2000 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Aug 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.