High yield spring-ring micromirror
US6285490A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1999 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Dec 30, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0841
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An improved micromechanical device comprising a substrate (104), a deflectable member (102) suspended over the substrate (104), at least one spring-ring (124) supported above the substrate (104); and at least one address electrode (110) spaced apart from substrate (104). The spring-ring (124) resists deflection of the deflectable member (102) when the deflectable member (102) deflects to contact the spring-ring (124). By moving the address electrode (110) off the substrate level, the micromirror is much more immune to particle-caused short circuits, and a planer surface on which to fabricate the mirror (102) is provided without the need to utilize an inverse spacer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.