Method and system for manufacturing a molded body
US6287164A · kind A · utility
9Cited by
20References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2000 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Sep 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for fabricating molded components which include a molded body and a plurality of electrically conductive leads protruding therefrom. These components are made by overlaying an anode lead frame having anode leads, on a cathode lead frame having cathode leads, and then depositing molding material on intersected anode and cathode leads. The molded components are manufactured in an assembly line process which includes a feeder to feed the anode and cathode lead frames and a molder to deposit the molding material. Preferably, these molded components are lamp tiles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.