Slurry supply system for chemical mechanical polishing process having sonic wave generator
US6287192A · kind A · utility
7Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1999 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Jun 7, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for supplying slurry to a processing facility, includes a tank containing the slurry, and slurry supply piping connected to the tank to allow the slurry to flow from the tank to the processing facility. A sonic wave generator is disposed along the slurry supply piping, such that sonic waves are propagated through the slurry. The sonic waves prevent the clustering of small primary abrasive particles into larger secondary abrasive particles, or break apart any clustered secondary particles, which may cause fine scratches on the surface of a wafer during a polishing operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.