Spring clip for sensitive substrates
US6287385A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 29, 1999 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Oct 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68771
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved restraining clip for holding fragile substrates has been invented. The clip can be used to provide a force on the backside of substrates during processing. The invention has a compound spring mechanism, effectively uncoupling the force used to hold the substrate from that applied by an operator to move the clip. The preferred configuration incorporates a multiple leaf spring for providing force to the substrate, a coil spring to hold the clip in place, and a lever arm for the operator to provide lifting and turning forces on the clip. This combination of features allows the clip to be used on fragile substrates, such as Ga--As, which are easily damaged by other clips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.