Radiation curable resin composition for cast polymerization
US6288136A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Feb 11, 2000 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Feb 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A radiation curable resin composition capable of producing molded articles which have excellent transparency, small light-coloring resistance, high dimensional accuracy, high surface hardness, and high thermal resistance. The radiation curable resin composition for cast polymerization, comprises (A) a (meth)acryloyl group-containing compound represented by the following general formula (1): ##STR1## wherein R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents an alkylene group or a hydroxyalkylene group having 2-6 carbon atoms, R.sup.3 represents a divalent organic group, n denotes an integer from 0 to 6, m denotes an integer from 1 to 10, and L denotes an integer from 0 or 1; (B) a (meth)acryloyl group-containing compound represented by the following general formula (2): ##STR2## wherein R.sup.4 represents a hydrogen atom or a methyl group, R.sup.5 represents an alkylene group having 2-6 carbon atoms, and p denotes an integer from 1 to 16; and (C) a radiation active initiator possessing a specific molar absorption coefficient, respectively in a specific amount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.