Hot melt adhesive composition including surfactant
US6288149A · kind A · utility
30Cited by
4References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 8, 1999 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Oct 8, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesive compositions are disclosed that include a block copolymer that includes monomers selected from the group consisting of styrene, isoprene, butadiene, and combinations thereof, from about 0.5% to about 10% by weight surfactant, and a tackifying agent. The adhesive composition has a surface tension of at least about 34 dynes/cm.sup.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.