Butadiene rubber particles with secondary particle sizes for epoxy resin encapsulant
US6288169A · kind A · utility
6Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1999 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Apr 22, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 .mu.m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 .mu.m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 .mu.m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.