Removable adhesive of polyepoxide, curing agent and microspheres
US6288170A · kind A · utility
18Cited by
21References
33Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 6, 1999 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Oct 6, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A thermosetting adhesive comprising a polyepoxide resin, a curing agent such as an imidazole and polymeric or elastomeric microspheres is removable when heated to a temperature greater than the use temperature of from about room temperature to about 185.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.