Temperature controlled high power burn-in board heat sinks
US6288371A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1999 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Jul 13, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2849
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A heat sink is used for thermally controlling a chip on a burn-in board which is being tested in a burn-in oven. The heat sink includes a resiliently mounted block that will engage a chip under resilient pressure and which is housed in a separate cup that permits accommodating misalignments or shifting of the heat sink when it contacts the chip. Additionally, the block carries a temperature sensor that is resiliently loaded against a chip which the heat sink engages. A bore mounts the temperature sensor and is also connected to a source of helium to provide a layer of helium between a surface of the heat sink and the adjacent surface of the chip for modifying the thermal coupling between the heat sink and the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.